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Precision Engineered Palladium Coated Copper Wire for in Semiconductor Device Packaging and Wire Interconnection

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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    Buy cheap Precision Engineered Palladium Coated Copper Wire for in Semiconductor Device Packaging and Wire Interconnection from wholesalers
     
    Buy cheap Precision Engineered Palladium Coated Copper Wire for in Semiconductor Device Packaging and Wire Interconnection from wholesalers
    • Buy cheap Precision Engineered Palladium Coated Copper Wire for in Semiconductor Device Packaging and Wire Interconnection from wholesalers
    • Buy cheap Precision Engineered Palladium Coated Copper Wire for in Semiconductor Device Packaging and Wire Interconnection from wholesalers
    • Buy cheap Precision Engineered Palladium Coated Copper Wire for in Semiconductor Device Packaging and Wire Interconnection from wholesalers
    • Buy cheap Precision Engineered Palladium Coated Copper Wire for in Semiconductor Device Packaging and Wire Interconnection from wholesalers
    • Buy cheap Precision Engineered Palladium Coated Copper Wire for in Semiconductor Device Packaging and Wire Interconnection from wholesalers

    Precision Engineered Palladium Coated Copper Wire for in Semiconductor Device Packaging and Wire Interconnection

    Ask Lasest Price
    Brand Name : WINNER
    Model Number : PW-12
    Certification : ISO9100
    Price : 999
    Payment Terms : L/C,Western Union,T/T Supply Ability
    Supply Ability : 100000 rolls per month
    Delivery Time : 5-8 WORKING DAYS
    • Product Details
    • Company Profile

    Precision Engineered Palladium Coated Copper Wire for in Semiconductor Device Packaging and Wire Interconnection

    Palladium Coated Copper Bonding Wire

    Pd coated Copper wire is a winded,smooth surfaced, unpolluted bonding wire, ideal for wire bonding in IC semiconductor applications. It is available in thicknesses ranging from 18 to 25 microns and is fully compliant with the RoHS requirements of specific hazardous substance control.

    Key Advantages
    • Enhanced bonding performance and stability
    • Superior oxidation control on copper surface
    • Extended HAST (Highly Accelerated Stress Test) reliability
    • Corrosion protection against halide attack from molding compounds
    • Wider bonding parameter window
    Performance Benefits
    • High bonding reliability is obtained by stable palladium distribution to FAB surface layer
    • High and stable stitch bondability
    • Wide bonding window
    Company Information
    Quality Precision Engineered Palladium Coated Copper Wire for in Semiconductor Device Packaging and Wire Interconnection for sale
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